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19-1897 Rev 0; 1/01
NUAL KIT MA T ATION A SHEE EVALU S DAT OLLOW F
Low-Power Cellular Upconverter-Driver
Features
o Ultra-Small Implementation Size o Low Off-Chip Component Count o 15mA at -15dBm POUT o 34mA at +6.5dBm POUT and -53dBc ACPR o <1A Shutdown Mode o Separate Shutdown for LO Buffer o No External Logic Interface Circuitry Required
General Description
The MAX2307 is an integrated RF upconverter-driver optimized for the Japanese cellular frequency band. It can also be used for applications in the US cellular and ISM bands. Its low current consumption (15mA at -15dBm output) extends the average talk time. The image rejection is done using only two external inductors at the upconverter output because the image frequency in Japanese cellular phones is typically 330MHz away. This realizes the image rejection with no current consumption penalty and only two inexpensive off-chip components, saving cost and valuable board space. The MAX2307 has a separate shutdown control for the LO buffer to minimize VCO pulling. It comes in an ultrasmall 34 ultra-chipscale package (UCSP).
MAX2307
Applications
Cellular Handsets cdmaOneTM Handsets ISM Band
PART MAX2307EBC
Ordering Information
TEMP. RANGE -40C to +85C PIN-PACKAGE 3x4 UCSP
Pin Configuration
TOP VIEW (BUMPS ON BOTTOM)
VCC
Block Diagram
VCC
A
VCC
VCC MIXP
VCC MIXM
GND
VCCMIXP A2 A3 VCCMIXM IFINM C3 C2 IFINP
B
LOIN/ SHDNLO
B4
GC
RFOUT
RFOUT
B3 GC
C
GND
IFINP
IFINM
SHDN
C4 SHDN BIAS CTRL BIAS CTRL2
1
2
3
4
B1 LOIN/SHDNLO SHDNLO
LOIN
cdmaOne is a trademark of CDMA Development Group. ________________________________________________________________ Maxim Integrated Products 1
For price, delivery, and to place orders, please contact Maxim Distribution at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
Low-Power Cellular Upconverter-Driver MAX2307
ABSOLUTE MAXIMUM RATINGS
VCC, RFOUT to GND .............................................-0.3V to +5.5V SHDN to GND.............................................-0.3V to (VCC + 0.3V) RF, IF Input Power ..............................................................0dBm Continuous Power Dissipation (TA = +70C) 34 UCSP (derate 80mW/C above +70C) .................628mW Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +160C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = +2.8V to +4.2V, TA = -40C to +85C, no RF/IF signals applied, V SHDN = V SHDNLO = +1.8V. Typical values are at VCC = +3.0V, TA = +25C, unless otherwise noted).
PARAMETER Supply Voltage Shutdown Supply Current Standby Supply Current Supply Current (Note 1) Supply Current with No RF Drive Gain Control Voltage SHDN, SHDNLO Logic High SHDN, SHDNLO Logic Low SHDN, SHDNLO Logic Current High SHDN, SHDNLO Logic Current Low 1 SYMBOL VCC ICC ICC ICC ICC VGC SHDN = SHDNLO = 0.6V SHDN = 0.6V, SHDNLO = 1.8V VGC = 2.2V, POUT = +6.5dBm VGC = 2.2V, POUT = +2dBm VGC = 0.5V VGC = 2.2V 0 1.8 0 0.6 1 CONDITIONS MIN 2.8 0.1 2.5 33.5 29.5 14 28 TYP MAX 4.2 20 4 42 38 20 36.5 3.0 mA V V V A A mA UNITS V A mA
2
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Low-Power Cellular Upconverter-Driver
AC ELECTRICAL CHARACTERISTICS
(MAX2307 Evaluation Kit, VCC = +2.8V to +4.2V, TA = -40C to +85C, fRF = 887MHz to 925MHz, fLO = 722MHz to 760MHz, fIF = 165MHz, PIFIN = -20dBm, PLOIN = -15dBm, V SHDN = V SHDNLO = +1.8V, 50 system. Typical values are at VCC = 3.0V, V SHDN = V SHDNLO = 1.8V, fRF = 906MHz, TA = +25C, unless otherwise noted.) (Note 1)
PARAMETER RF Frequency Range (Note 2) VGC = 2.2V, VCC = 3.0V, TA = +25C Power Gain Output Power LO Input Power Level Gain Control Range Gain Control Slope (Note 3) Adjacent Channel Power Ratio Alternate Channel Power Ratio RX Band Noise Power (Note 4) LO Leakage Image Leakage (Note 1) ACPR1 ACPR2 PNOISE VGC = 0.5V to 2.2V, PIFIN = -30dBm VGC = 0.5V to 2.2V, PIFIN = -30dBm Offset = 885kHz in 30kHz BW Offset = 1.98MHz in 30kHz BW POUT = 6.5dBm PIFIN = -50dBm, VGC = 0.5V POUT from +6.5dBm to -8dBm POUT from 6.5dBm to -8dBm, fRF = 887MHz to 925MHz, fIMAGE = 557MHz to 595MHz -134 -147 -43 -40 -30 -25 G POUT VGC = 2.2V, VCC = 2.8V to 4.2V, TA = TMIN to TMAX VGC = 2.2V, ACPR -53dBc, ALT -65dBc SYMBOL CONDITIONS MIN 887 21.5 17 4.5 -15 18 24.5 24.5 6.5 -12 23 32 36 -53 -65 -131 -5 TYP MAX 925 27.5 32.5 dB dBm dBm dB dB/V dBc dBc dBm/Hz dBc dBc UNITS MHz
MAX2307
Note 1: Note 2: Note 3: Note 4:
Minimum and maximum limits are guaranteed by design and characterization. See Typical Operating Characteristics for operation outside this frequency range. Slope measured with VGC = +0.5V and VGC = +0.8V. fRF = 925MHz, noise measured at 870MHz.
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3
Low-Power Cellular Upconverter-Driver MAX2307
Typical Operating Characteristics
(MAX2307 Evaluation Kit, VCC = +2.8V, VGC = 2.2V, V SHDN = V SHDNLO = VCC, fRF = 906MHz, fIF = 165MHz, fLO = 741MHz, TA = +25C, unless otherwise noted.)
SHUTDOWN SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX2307 toc01
TOTAL SUPPLY CURRENT vs. OUTPUT POWER
33 TOTAL SUPPLY CURRENT (mA) 32 31 30 29 28 27 26 25 24 6 -10 -8 -6 -4 -2 TA = -40C TA = +25C TA = +85C VGC = 2.2V
MAX2307 toc02
TOTAL SUPPLY CURRENT vs. GAIN CONTROL VOLTAGE
MAX2307 toc03
0.9 SHUTDOWN SUPPLY CURRENT (A) 0.8 0.7 0.6 0.5 0.4 TA = -40C 0.3 2 3 4 VCC (V) 5 NO RF SIGNALS APPLIED VGC = 0 TA = +85C TA = +25C
34
31 TOTAL SUPPLY CURRENT (mA) 28 25 22 TA = -40C 19 16 13 NO RF SIGNALS APPLIED 10 TA = +85C TA = +25C
0
2
4
6
0
0.5
1.0
1.5 VGC (V)
2.0
2.5
3.0
POUT (dBm)
CONVERSION GAIN vs. RF FREQUENCY
MAX2307 toc04
CONVERSION GAIN vs. RF FREQUENCY
MAX2307 toc05
CONVERSION GAIN vs. GAIN CONTROL VOLTAGE
TA = +25C TA = -40C
MAX2307 toc06
35 TA = -40C 30 CONVERSION GAIN (dB) TA = +25C
27 26 25 CONVERSION GAIN (dB) 24 23 22 21 20 19 VCC = +2.8V VCC = +3.3V VCC = +4.2V
40 30 CONVERSION GAIN (dB) 20 10 0 -10 -20 TA = +85C
25
20 TA = +85C 15 PIFIN = -30dBm 10 840 860 880 900 920 940 960 RF FREQUENCY (MHz)
18 17 840 860 880 900
PIFIN = -30dBm 920 940 960
PIFIN = -30dBm -30 0 0.5 1.0 1.5 VGC (V) 2.0 2.5 3.0
RF FREQUENCY (MHz)
CONVERSION GAIN vs. LO INPUT POWER
MAX2307 toc07
OUTPUT POWER vs. RF FREQUENCY
ACPR -53dBc ALT1 -65dBc
MAX2307 toc08
7.1 7.0 6.9
33 TA = -40C CONVERSION GAIN (dB) 30 27 24 21 18 PIFIN = -30dBm 15 -17 -15 -13 -11 PLOIN (dBm) -9 -7 -5 TA = +25C TA = +85C
POUT (dBm)
6.8 6.7 6.6 6.5 6.4 885 895 905 915 925 RF FREQUENCY (MHz)
4
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Low-Power Cellular Upconverter-Driver MAX2307
Typical Operating Characteristics (continued)
(MAX2307 Evaluation Kit, VCC = +2.8V, VGC = 2.2V, V SHDN = V SHDNLO = VCC, fRF = 906MHz, fIF = 165MHz, fLO = 741MHz, TA = +25C, unless otherwise noted.)
ACPR AND ALT vs. OUTPUT POWER
-30 ACPR AND ALT1 (dBc) -40 -50 -60 -70 -80 D -90 -100 -8 -5 -2 1 POUT (dBm) VARYING PIFIN, VGC = +2.2V 4 7 F E ACPR: A. TA = +85C B. TA = +25C C. TA = -40C C A ALT1: D. TA = +85C E. TA = +25C F. TA = -40C B
MAX2307 toc10
RX BAND NOISE POWER vs. RF FREQUENCY
MAX2307 toc12
RX BAND NOISE POWER vs. OUTPUT POWER
MAX2307 toc13
-20
-133.5 RX BAND NOISE POWER (dBm/Hz) -134.0 -134.5 -135.0 TA = +85C -135.5 -136.0 -136.5 -137.0 880 TA = +25C TA = -40C
-130 RX BAND NOISE POWER (dBm/Hz)
-135 TA = -40C -140 TA = +85C -145
-150 TA = +25C -155
890
900
910
920
930
-50
-40
-30
-20 POUT (dBm)
-10
0
10
fRF (MHz)
LO LEAKAGE vs. OUTPUT POWER
MAX2307 toc14
LO LEAKAGE vs. OUTPUT POWER
TA = +25C A = PLOIN = -17dBm B = PLOIN = -11dBm C = PLOIN = -5dBm
MAX2307 toc15
LO LEAKAGE vs. OUTPUT POWER
TA = +85C A = PLOIN = -17dBm B = PLOIN = -11dBm C = PLOIN = -5dBm
MAX2307 toc16
-10 -20 LO LEAKAGE (dBc) -30 -40 -50 -60 -70 -80 -10 -4.5 POUT (dBm) 1.0 fRF = 887MHz
-10 -20 LO LEAKAGE (dBc) -30 -40 C -50 B -60 A -70 -80
-10 -20 LO LEAKAGE (dBc) -30 -40 C -50 -60 A -70 -80 B
fRF = 906MHz fRF = 925MHz
6.5
-10
-4.5 POUT (dBm)
1.0
6.5
-10
-4.5 POUT (dBm)
1.0
6.5
LO LEAKAGE vs. OUTPUT POWER
TA = -40C A = PLOIN = -17dBm B = PLOIN = -11dBm C = PLOIN = -5dBm C B A -60 -70 -80 -10 -4.5 POUT (dBm) 1.0 6.5
MAX2307 toc17
IMAGE LEAKAGE vs. RF FREQUENCY
-41 IMAGE SUPPRESSION (dBc) -42 -43 -44 -45 -46 -47 -48 -49 -50 885 895 905 915 925 RF FREQUENCY (MHz) TA = +25C TA = -40C TA = +85C
MAX2307 toc18
-10 -20 LO LEAKAGE (dBc) -30 -40 -50
-40
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5
Low-Power Cellular Upconverter-Driver MAX2307
Typical Operating Characteristics (continued)
(MAX2307 Evaluation Kit, VCC = +2.8V, VGC = 2.2V, V SHDN = V SHDNLO = VCC, fRF = 906MHz, fIF = 165MHz, fLO = 741MHz, TA = +25C, unless otherwise noted.)
S11 OF LO INPUT
45
MAX2307 toc19
MAXIMUM INPUT POWER
MAX2307 toc09
MAXIMUM OUTPUT POWER
20 15 10 POUT (dBm) 5 0 -5 ACPR 53dBc ALT1 -65dBc ACPR > -53dBc ALT1 > -65dBc
MAX2307 toc20
-35
-15.0 -15.5 ACPR > -53dBc ALT1 > -65dBc
REAL IMPEDANCE ()
C, E, G 35 D, F 30 A R H -50 -45
IMAGINARY IMPEDANCE ()
40
-40
-16.0 -16.5 PIN (dBm) -17.0 -17.5 -18.0 -18.5 -19.0 -19.5 ACPR -53dBc ALT1 -65dBc
25
-55
-10 -15 -20 0.5 1.0 1.5 2.0 2.5 3.0 0.5 1.0 1.5 2.0 2.5 3.0 VGC (V) VGC (V)
20
-60 600 650 700 750 800 850 900 950 1000 fLO (MHz) SHDN = SHDNLO = VCC SHDN = VCC, SHDNLO = GND A = REAL, B = IMAGINARY E = REAL, F = IMAGINARY SHDN = SHDNLO = GND SHDN = GND, SHDNLO = VCC C = REAL, D = IMAGINARY G = REAL, H = IMAGINARY
-20.0
Pin Description
PIN A1 A2, A3 NAME VCC VCCMIXP, VCCMIXM LOIN/ SHDNLO GC RFOUT FUNCTION Supply Pin. Bypass with 100pF and 0.01F capacitors as close to the pin as possible. Mixer Supply Pins. Require pullup inductors, which are used as part of the image rejection filter network. Supply to inductors should be locally bypassed with 100pF and 0.01F capacitors. LO Input and LO Buffer Shutdown. Apply both LO input signal and LO buffer shutdown control to this pin. The LO path requires a DC-blocking capacitor. A logic high on SHDNLO turns on the LO buffer, and a logic low turns off the LO buffer, independently of SHDN. The shutdown control requires a 10k isolation resistor in order not to load the LO signal. Gain Control Pin. Apply a voltage between 0 to 3V to vary the gain of the IC. PA Driver Output. Requires an inductor pullup and a DC-blocking capacitor. These components are also the matching elements. GND Connection. Solder directly to the PCB ground plane, with three ground vias around the corner of the UCSP, as close to bump as possible. It is imperative that GND sees a low inductance to the system ground plane. See the MAX2307 EV Kit as an example. Upconverter IF Inputs. AC-couple IF signals to these pins. Shutdown Control. HIGH turns on the device except the LO buffer, LOW turns off the device except the LO buffer.
B1
B3 B4
A4, C1
GND IFINP, IFINM SHDN
C2, C3 C4
6
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Low-Power Cellular Upconverter-Driver
Typical Operating Circuit
VCC
L1 5.6nH VCC C3 4.7F C2 0.01F VCC SHDNLO C4 100pF LOIN GND IFINP C1 100pF R1 10k LOIN/SHDNLO
L2 5.6nH
C6 100pF VGC
C7 0.01F R2 10k VCC C13 100pF C14 0.01F
using on-chip inductors to ensure sufficient selectivity for image rejection. The Q of the off-chip tank inductor directly determines the image suppression level and usable bandwidth. The MAX2307 also provides a continuous variable gain function, enabling at least 20dB of gain control using an external control voltage input.
MAX2307
VCCMIXP VCC
VCCMIXM GC C12 0.01F
PA Driver
The MAX2307 utilizes a class AB driver stage. Unlike class A or B, class AB action offers both good linearity and low current consumption. Current consumption of class AB is proportional to the output power at high drive levels. RFOUT is an open-collector output that requires an external inductor to VCC for proper biasing. For optimum performance, implement an impedance-matching network. The configuration and values for the matching network depend on the transmit frequency, performance, and desired output impedance. For simultaneous optimum linearity and return loss, the real part of the load impedance should be about 100. The device's internal 0.5pF shunt parasitic needs to be absorbed by the matching network. For matching network values for the Japanese cellular transmit band, see the MAX2307 EV kit data sheet.
MAX2307 GND
RFOUT
L4 6.2nH
RFOUT VCC SHDN IFINM SHDN C16 3.0pF
IF INPUT
Applications Information
Local Oscillator LOIN/SHDNLO Input
The LO input is a single-ended broadband port. The LO signal is mixed with the input IF signal and the resulting upconverted output appears on the RFOUT pin. AC-couple the LO pin with a capacitor having less than 3 reactance at the LO frequency. This device also contains an internal LO buffer and supports an LO signal ranging from -15dBm to -5dBm. SHDNLO turns the LO buffer on and off independent of the rest of the IC and shares the same pin as LOIN. To avoid loading of the LO, connect a 10k isolation resistor between the LOIN/SHDNLO pin and the SHDNLO logic output. The SHDNLO control can help reduce VCO pulling in gated-transmission mode by providing a means to keep the LO buffer on while the upconverter and driver turn on and off.
Layout Issues
For best performance, pay close attention to powersupply issues, as well as to the layout of the RFOUT matching network. The EV kit can be used as a layout example. Ground connections and supply bypassing are the most important.
Power Supply and SHDN_ Bypassing
Bypass VCC with a 100pF capacitor in parallel with a 0.01F RF capacitor. Use separate vias to the ground plane for each of the bypass capacitors and minimize trace length to reduce inductance. Use three separate vias to the ground plane for each ground pin.
IF Input
The MAX2307 has a differential IF input port for interfacing to differential IF filters. AC-couple the IF pins with a capacitor. The typical IF input frequency is 165MHz, but device can operate from 130MHz to 230MHz. The differential impedance between the two IF inputs is approximately 400 in parallel with 0.5pF.
Power-Supply Layout
To minimize coupling between different sections of the IC, the ideal power-supply layout is a star configuration with a large decoupling capacitor at a central V CC node. The V CC traces branch out from this central node, each going to a separate VCC node in the PC board. At the end of each trace is a bypass capacitor with low ESR at the RF frequency of operation. This arrangement provides local decoupling at each VCC pin. At high frequencies, any signal leaking out of one supply pin sees a relatively high impedance (formed by the VCC trace inductance) to the central VCC node, and an even higher impedance to any other supply pin, as
7
Mixer
The MAX2307 uses a double-balanced differential upconverting mixer. Two inductors connecting the mixer output pins (A2 and A3) to VCC in conjunction with an on-chip capacitor achieve image suppression. This method allows image rejection with no current consumption penalty, and permits much higher Q than
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Low-Power Cellular Upconverter-Driver MAX2307
well as a low impedance to ground through the bypass capacitor.
____________________Chip Information
TRANSISTOR COUNT: 693 PROCESS TECHNOLOGY: Silicon Bipolar
Impedance-Matching Network Layout
The RFOUT matching network is very sensitive to layout-related parasitics. To minimize parasitic inductance, keep all traces short and place components as close as possible to the chip. To minimize parasitic capacitance, minimize the area of the plane.
Package Information
12L, UCSP 4x3.EPS
8
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